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Advanced X-ray Imaging Technologies for Heterogeneous 3D IC Package Metrology and Inspection

The advent of 3D Heterogeneous Integration (3DHI) in advanced packaging and wafer-level IC packaging introduces significant challenges for inline defect inspection and offline failure analysis.

The 3D stacking and wafer bonding processes create optically opaque structures, necessitating techniques like x-rays to penetrate multiple buried layers for defect detection. However, as device features in 3DHI continue to shrink (e.g., microbumps shrinking to <10 µm in diameter and TSV interconnects scaling to single-digit micrometers), existing non-destructive techniques face substantial technological barrier